Lamination
Hot Press
Hot Press is a key lamination system used to bond prepreg and copper foil under high temperature and pressure in multilayer PCB, HDI PCB, IC package substrate, and CCL manufacturing.
Specifications
- Manufacturer
- Meiki / Kitagawa
- Model
- Hot Press / Cold Press
- Working Area
- PCB Panel Support
- Spindle
- -
- Speed
- Lamination Process
- Power
- Hot Press / Cold Press
- Voltage
- Factory Spec
- Application
- Multilayer PCB, HDI PCB, IC Package Substrate, CCL
Detailed Description
Overview
Hot Press is a core lamination system used in multilayer PCB manufacturing to bond prepreg and copper foil under high temperature and high pressure.
It is essential for securing interlayer adhesion and dimensional stability. After the heating lamination process with Hot Press, Cold Press is used for cooling and stabilization.
Hot Press systems from Meiki and Kitagawa are widely used in production lines for multilayer PCB, HDI PCB, IC package substrate, and copper clad laminate manufacturing.
Key Features
- Supports high-temperature and high-pressure PCB lamination
- Available with Hot Press and Cold Press configuration
- Suitable for prepreg and copper foil lamination
- Applicable to multilayer PCB production lines
- Vacuum system configuration available
- Can be integrated with automatic loading and unloading systems
- Stable temperature and pressure control
Applications
This equipment can be used for multilayer PCB, HDI PCB, IC package substrate, copper clad laminate, build-up PCB, and high-layer-count circuit board lamination processes.