GPE
Orbotech Exposure System 이미지 1

Exposure

Orbotech Exposure System

Orbotech Exposure System is a high-precision laser direct imaging system used for fine line, fine space, HDI PCB, IC package substrate, and mSAP manufacturing processes.

Specifications

Manufacturer
Orbotech
Model
Nuvogo / Paragon / Diamond Series
Working Area
Up to 635 x 812 mm class
Spindle
-
Speed
High-throughput direct imaging
Power
MultiWave Laser
Voltage
Factory Spec
Application
HDI PCB, mSAP, Flex PCB, IC Substrate

Detailed Description

Overview

Orbotech Exposure System is a high-precision LDI system that directly images circuit patterns onto PCB panels using laser direct imaging technology.

Representative models include Nuvogo 1000, Paragon 8800, Paragon Ultra, and Diamond Series. These systems are widely used for HDI PCB, mSAP, Flex PCB, Rigid-Flex PCB, and IC substrate production.

Because the system can form circuit patterns without photo masks, it is suitable for fine line and fine space applications, offering high accuracy and productivity in advanced PCB mass production lines.

Key Features

  • Laser Direct Imaging technology
  • Maskless circuit pattern exposure
  • Fine line and fine space pattern formation
  • Supports HDI and IC substrate processes
  • Applicable to mSAP process
  • High alignment accuracy
  • Supports automatic handling and MES integration

Applications

This system can be used for HDI PCB, mSAP PCB, Flex PCB, Rigid-Flex PCB, IC package substrate, inner layer, outer layer, and solder mask exposure processes.